Empower Semiconductor on julkistanut ECAP-tuoteperheensä suurimman piipohjaisen kondensaattorin suurtaajuiseen erotukseen. Uusi EC1005P on 16,6 mikrofaradin kondensaattori, joka soveltuu vaativimpiin tehon- ja jännitteensäätöä edellyttäviin järjestelmäpiireihin.

EC1005P on erittäin matala komponentti, vain 1 millimetrin paksuinen. Näin matalalla profiililla se voidaan upottaa minkä tahansa SoC-piirin alustaan tai väliin. Tämä tekee kondensaattorista ihanteellisen useisiin korkean suorituskyvyn laskennan (HPC) ja tekoälyn (AI) sovelluksiin.

Empowerin tuotemarkkinoinnin johtaja Mukund krishnan mukaan SoC-piirien ja muiden suurten tietojenkäsittelyprosessorien suorituskyky paranee jatkuvasti. - On yhä vaikeampaa saavuttaa näiden laitteiden vaatimaa tehon eheyden ja jännitteen säätelyn tasoa perinteisillä monikerroksisilla keraamisilla MLCC-kondensaattoreilla. EC1005P:ssä on lähes ihanteelliset loisparametrit, joiden ansiosta nämä piirit voivat toimia pienemmällä jännitemarginaalilla ja vähentää lopulta järjestelmän tehonkulutusta.

EC1005P ECAP hyödyntää Empowerin korkean suorituskyvyn ja tiheyden piikondensaattoritekniikkaa täyttääkseen "viimeisen tuuman" erotuksen jännitteensäätimistä SoC-syöttönastoihin. Tämä lähestymistapa korvaa useita erillisiä komponentteja, joilla on paljon pienempi suorituskyky ja suurempi jalanjälki yhdellä monoliittisella sirulla, joka tarjoaa optimaalisen sähköisen suorituskyvyn ja yksinkertaistaa suunnittelun monimutkaisuutta.

EC1005P-piirin ESL-arvo (ekvivalentti sarjainduktanssi) on erittäin pieni eli alle 1 pikohenryä ja ESR eli vastaava sarjaresistanssi alle 3 milliohmia. Piirin mitat ovat 3,643 x 3,036 millimetriä. Sen vakioprofiili on 784 mikronia, joka voidaan räätälöidä erilaisiin korkeusvaatimuksiin.

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